Patent Assignment
Reel/Frame 035888/0807
Assignment of Assignor's Interest
Recorded: 2015-06-11
Pages: 152
Assignor
SPANSION LLC
Executed: 2015-06-01
Assignee
CYPRESS SEMICONDUCTOR CORPORATION
198 CHAMPION COURT, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(15)
Method of Fabricating a Semiconductor Device Used in a Stacked-Type Semiconductor Device
Read-only memory array with dielectric breakdown programmability
Application:
11/136,981 →
Publication:
US 2006/0268593
Memory device with improved data retention
Application:
11/174,861 →
Publication:
US 2007/0007585
Stackable memory device and organic transistor structure
Application:
11/174,881 →
Publication:
US 2007/0007510
Method of forming gate electrode structures
Application:
11/201,042 →
Publication:
US 2007/0037371
Semiconductor device and method for boosting word line
Application:
11/214,633 →
Publication:
US 2006/0077745
Method for forming spacers between bitlines in virtual ground memory array and related structure
Application:
11/227,749 →
Publication:
US 2007/0054463
Semiconductor device and data reading method
Application:
11/228,840 →
Publication:
US 2006/0077747
Decoder for memory device with loading capacitor
Application:
11/243,078 →
Publication:
US 2007/0076513
Semiconductor bonding pad and method of fabricating the same
Application:
11/257,825 →
Publication:
US 2006/0091537
Semiconductor device and method of fabricating the same
Application:
11/258,823 →
Publication:
US 2006/0214218
Multi-chip package and method of fabricating the same
Application:
11/261,174 →
Publication:
US 2006/0108677
Fabrication method for a semiconductor device
Semiconductor device and method of fabricating the same
Application:
11/341,932 →
Publication:
US 2006/0244019
Semiconductor device and fabrication method therefor
Application:
11/363,792 →
Publication:
US 2006/0281242
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 25, 2005
From: DING, MENG; LIU, ZHIZHENG; HE, YI; RANDOLPH, MARK
To: SPANSION LLC
Reel/Frame 016604/0136 →
Assignment of Assignor's Interest
Jul 5, 2005
From: SOKOLIK, IGOR; KINGSBOROUGH, RICHARD; GAUN, DAVID; KAZA, SWAROOP
To: SPANSION LLC
Reel/Frame 016728/0113 →
Assignment of Assignor's Interest
Jul 5, 2005
From: SOKOLIK, IGOR; PANGRLE, SUZETTE; KRIEGER, JURI
To: SPANSION LLC
Reel/Frame 016730/0204 →
Assignment of Assignor's Interest
Aug 10, 2005
From: WANG, ZHIGANG; YANG, NIAN; FANG, SHENQING
To: SPANSION LLC
Reel/Frame 016887/0658 →
Assignment of Assignor's Interest
Aug 11, 2005
From: SHINMA, YASUHIRO; KASAI, JUNICHI; MEGURO, KOUICHI; ONODERA, MASANORI
To: SPANSION LLC
Reel/Frame 016877/0442 →
Assignment of Assignor's Interest
Sep 15, 2005
From: OGAWA, HIROYUKI
To: SPANSION LLC
Reel/Frame 017005/0141 →
Assignment of Assignor's Interest
Oct 4, 2005
From: YANG, NIAN; LAI, FAN WAN; CHEN, HOUNIEN
To: SPANSION LLC
Reel/Frame 017071/0477 →
Assignment of Assignor's Interest
Oct 24, 2005
From: SUZUKI, SEIICHI
To: SPANSION LLC
Reel/Frame 017134/0177 →
Assignment of Assignor's Interest
Dec 27, 2005
From: YANO, MASARU; KUROSAKI, KAZUHIDE; KITAZAKI, KAZUHIRO
To: SPANSION LLC
Reel/Frame 017367/0786 →
Assignment of Assignor's Interest
Jan 30, 2006
From: IKEDA, MITSUTAKA; KIKUMA, KATSUHITO; NOGAMI, SACHIKO; AKASHI, YUJI
To: SPANSION LLC
Reel/Frame 017521/0416 →
Corrective Assignment to Correct the Second Inventor's Name. Document Previously Recorded at Reel 013406 Frame 0066
Apr 25, 2006
From: KITAZAKI, KUZUHIRO; KUROSAKI, KAZUHIDE
To: SPANSION LLC
Reel/Frame 017814/0207 →
Assignment of Assignor's Interest
Jun 5, 2006
From: SHISHIDO, KIYOKAZU; LI, WENMEI; GAO, PEI-YUAN; HIGASHI, MASAHIKO
To: SPANSION LLC
Reel/Frame 017735/0851 →
Assignment of Assignor's Interest
Jun 30, 2006
From: SUGIZAKI, MASAO; KABASHIMA, KATSUHIKO; TANAKA, TOSHIYUKI
To: SPANISION LLC
Reel/Frame 017881/0045 →
Assignment of Assignor's Interest
Aug 14, 2006
From: ARAKAWA, HIDEKI; ITO, TAKUO
To: SPANSION LLC
Reel/Frame 018117/0206 →
Assignment of Assignor's Interest
Aug 21, 2006
From: TAKAGUCHI, NAOKI; MIZUGUCHI, YUJI; OKANISHI, MASATOMI; TAKAMATSU, TSUKASA
To: SPANSION LLC
Reel/Frame 018155/0777 →
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest
Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Partial Release of Security Interest in Patents
Sep 26, 2019
From: MUFG UNION BANK, N.A., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 050500/0369 →
Assignment and Assumption of Security Interest in Intellectual Property
Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst.
Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
Release of Security Interest
Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
Assignment of Assignor's Interest
Apr 15, 2022
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES LLC
Reel/Frame 059721/0467 →