Patent Assignment
Reel/Frame 017735/0851
Assignment of Assignor's Interest
Recorded: 2006-06-05
Pages: 12
Assignors
SHISHIDO, KIYOKAZU
Executed: 2006-02-23
LI, WENMEI
Executed: 2006-02-23
GAO, PEI-YUAN
Executed: 2006-05-19
HIGASHI, MASAHIKO
Executed: 2006-05-19
CHENG, NING
Executed: 2006-05-04
ENDA, TAKAYUKI
Executed: 2006-05-31
NGO, MINH VAN
Executed: 2006-02-17
RAMSBEY, MARK T.
Executed: 2006-05-30
HUI, ANGELA T.
Executed: 2006-04-20
TOKUNO, HIROKAZU
Executed: 2006-05-26
Assignee
SPANSION LLC
ONE AMD PLACE, P.O. BOX 3453, SUNNYVALE, CALIFORNIA, 94088--3453
Covered Property
(1)
Semiconductor device and method of fabricating the same
Application:
11/258,823 →
Publication:
US 2006/0214218
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Assignment of Assignor's Interest
Jun 11, 2015
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 035888/0807 →