Patent Assignment
Reel/Frame 017548/0439
Assignment of Assignor's Interest
Recorded: 2006-02-06
Pages: 6
Assignors
LEE, KYOUNG WOO
Executed: 2006-01-30
CHOI, SEUNG-MAN
Executed: 2006-01-30
KU, JA-HUM
Executed: 2006-01-30
PARK, KI-CHUL
Executed: 2006-01-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Dual-Damascene Interconnect Structures on Semiconductor Substrates Using Multiple Planarization Layers Having Different Porosity Characteristics
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.