IP Library Assignment 017549/0684
Patent Assignment
Reel/Frame 017549/0684

Assignment of Assignor's Interest

Recorded: 2005-08-02 Pages: 2
Assignors
REENTS, BERT
Executed: 2005-07-18
MAGAYA, TAFADZWA
Executed: 2005-07-18
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, 10553, BERLIN, 10553, GERMANY
Covered Property (1)
Method of electroplating a workpiece having high-aspect ratio holes
Application: 10/544,252 →
Publication: US 2006/0151328
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Release of Security Interest Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →