Patent Assignment
Reel/Frame 017560/0259
Assignment of Assignor's Interest
Recorded: 2006-02-10
Pages: 3
Assignor
OOTA, MITSURU
Executed: 2006-01-24
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
A Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.