Patent Assignment
Reel/Frame 017578/0297
Assignment of Assignor's Interest
Recorded: 2006-02-13
Pages: 3
Assignors
SAN, LIM SIONG
Executed: 2006-02-09
CHOON, NEO MOK
Executed: 2006-02-09
LIM, KEVIN
Executed: 2006-02-09
YEOW, KELVIN
Executed: 2006-02-09
Assignee
SANMINA-SCI CORPORATION
2700 NORTH FIRST STREET, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Method and Process for Embedding Electrically Conductive Elements in a Dielectric Layer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 5, 2014
From: SANMINA CORPORATION, AS GRANTOR; SANMINA CORPORATION, F/K/A SANMINA-SCI CORPORATION, AS GRANTOR; HADCO SANTA CLARA, INC., AS GRANTOR; SCI TECHNOLOGY, INC., AS GRANTOR
To: US BANK NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 033094/0826 →
Release of Security Interest
Jun 5, 2019
From: U.S. BANK NATIONAL ASSOCIATION, SOLELY AS NOTES COLLATERAL AGENT
To: SANMINA CORPORATION; HADCO CORPORATION; HADCO SANTA CLARA; SCI TECHNOLOGY
Reel/Frame 049378/0927 →
Security Interest
Oct 28, 2025
From: SANMINA CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 073363/0212 →