IP Library › Assignment 017616/0031
Patent Assignment
Reel/Frame 017616/0031

Assignment of Assignor's Interest

Recorded: 2006-02-24 Pages: 2
Assignor
EGAWA, YOSHIMI
Executed: 2006-01-25
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO 105-8460, JAPAN
Covered Property (1)
Semiconductor Device Having a Package Base with at Least One Through Electrode
Patent: 7,898,086 →
Application: 11/360,570 →
Publication: US 2006/0202347
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 8, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022092/0903 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest Apr 11, 2022
From: LAPIS SEMICONDUCTOR CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 059559/0280 →
Assignment of Assignor's Interest Jun 19, 2022
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0398 →