IP Library Assignment 017620/0872
Patent Assignment
Reel/Frame 017620/0872

Assignment of Assignor's Interest

Recorded: 2006-05-12 Pages: 4
Assignors
OGAWA, KENTA
Executed: 2006-03-28
TSUKANO, JUN
Executed: 2006-03-28
MAEDA, TAKEHIKO
Executed: 2006-03-28
SHIMOTO, TADANORI
Executed: 2006-03-28
YAMAMICHI, SHINTARO
Executed: 2006-03-28
BABA, KAZUHIRO
Executed: 2006-03-28
Assignees
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO 108-8001, JAPAN
Covered Property (1)
Interconnecting Substrate and Semiconductor Device
Patent: 7,745,736 →
Application: 11/341,445 →
Publication: US 2006/0192287
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0815 →
Assignment of Assignor's Interest Jul 12, 2013
From: NEC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0873 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →