Patent Assignment
Reel/Frame 017624/0039
Assignment of Assignor's Interest
Recorded: 2006-03-01
Pages: 3
Assignor
TACHIBANA, HIROAKI
Executed: 2006-02-21
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method for Manufacturing Flip-Chip Type Semiconductor Device Featuring Nickel Electrode Pads, and Plating Apparatus Used in Such Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.