Assignment of Assignor's Interest

Recorded: 2006-05-17 Pages: 4

Assignors

MACNAMARA, CORMAC

Executed: 2006-04-26

BROGAN, CONOR

Executed: 2006-04-18

GRIFFIN, HUGH J.

Executed: 2006-04-23

WILSON, ROBIN

Executed: 2006-04-18

Assignee

ICEMOS TECHNOLOGY CORPORATION

P. O. BOX 24619, TEMPE, ARIZONA, 85285

Covered Property (1)

Silicon wafer having through-wafer vias

Application: 60/677,510 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.