IP Library › Patent Application 60677510
Patent Application Provisional
App. No. 60/677,510 · Confirmation No. 3267

Silicon wafer having through-wafer vias

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2005-05-04 TRNA Transmittal of New Application 1 View
2005-05-04 SPEC Specification 9 View
2005-05-04 CLM Claims 6 View
2005-05-04 ABST Abstract 1 View
2005-05-04 DRW Drawings-only black and white line drawings 14 View
2005-05-04 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/677,510
Filed
2005-05-04