IP Library › Assignment 017684/0578
Patent Assignment
Reel/Frame 017684/0578

Assignment of Assignor's Interest

Recorded: 2006-03-23 Pages: 2
Assignor
SAEKI, YOSHIHIRO
Executed: 2006-03-09
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property (1)
Semiconductor Device Including Substrate and Upper Plate Having Reduced Warpage
Patent: 7,679,175 →
Application: 11/386,841 →
Publication: US 2006/0214277
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 16, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022162/0586 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest Apr 11, 2022
From: LAPIS SEMICONDUCTOR CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 059559/0280 →
Assignment of Assignor's Interest Jun 19, 2022
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0398 →