Assignment of Assignor's Interest

Recorded: 2006-02-24 Received: 2006-03-06 Pages: 3

Assignor

RODRIGO, MIGUEL DE VEGA

Executed: 2006-01-10

Assignee

SIEMENS AKTIENGESELLSCHAFT

WITTELSBACHERPLATZ 2, MUENCHEN, DEX, 80333, GERMANY

Covered Properties (4)

Semiconductor Stacked Package Assembly Having Exposed Substrate Surfaces on Upper and Lower Sides

Application: 11/395,529 →

Semiconductor Package Including Second Substrate and Having Exposed Substrate Surfaces on Upper and Lower Sides

Application: 11/394,635 →

Semiconductor Assembly Including Chip Scale Package and Second Substrate with Exposed Surfaces on Upper and Lower Sides

Application: 11/397,027 →

Method for transmitting data packages

Application: 10/569,780 →