IP Library Assignment 017745/0677
Patent Assignment
Reel/Frame 017745/0677

Assignment of Assignor's Interest

Recorded: 2006-04-06 Pages: 3
Assignors
TING, SHYH-FANN
Executed: 2006-03-30
HUANG, CHENG-TUNG
Executed: 2006-03-30
HUNG, WEN-HAN
Executed: 2006-03-30
JENG, LI-SHIAN
Executed: 2006-03-30
CHENG, TZYY-MING
Executed: 2006-03-30
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property (1)
Semiconductor Structure and Fabrication Thereof
Patent: 7,410,875 →
Application: 11/400,077 →
Publication: US 2007/0238242
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →