Patent Assignment
Reel/Frame 017747/0595
Assignment of Assignor's Interest
Recorded: 2006-04-06
Pages: 2
Assignor
JEONG, YONG-SIK
Executed: 2006-03-30
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
1 HYANGIEONG-DONG, HEUNGDUK-GU, CHEONGIU-SI, CHUNGCHEONGBUK-DO, 361-725, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Semiconductor Device
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Release of Security Interest
Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party.
Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
Assignment of Assignor's Interest
Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
Change of Name
Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →