IP Library Assignment 017795/0685
Patent Assignment
Reel/Frame 017795/0685

Assignment of Assignor's Interest

Recorded: 2006-04-18 Pages: 4
Assignor
KUNIEDA, MASAFUMI
Executed: 2006-04-10
Assignee
IBIDEN CO., LTD.
1, KANDA-CHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property (1)
Honeycomb Structural Body and Sealing Material Layer
Patent: 7,846,526 →
Application: 11/317,199 →
Publication: US 2006/0177629