Patent Assignment
Reel/Frame 017825/0237
Assignment of Assignor's Interest
Recorded: 2006-04-27
Pages: 3
Assignors
KANG, BYOUNG-UN
Executed: 2005-07-25
KIM, JAI-HOON
Executed: 2005-07-25
SEO, JOON-MO
Executed: 2005-07-25
SUNG, TAE-HYUN
Executed: 2005-07-25
SHIN, DONG-CHEON
Executed: 2005-07-25
WI, KYUNG-TAE
Executed: 2005-07-25
Assignee
LS CABLE LTD.
19-20F ASEM TOWER 159 SAMSUNG-DONG, GANGNAM-GU, SEOUL 135-090, KOREA, REPUBLIC OF
Covered Property
(1)
Dicing Die Adhesive Film for Semiconductor
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Re-Record to Correct the Name of the First Assignor, Previously Recorded on Reel 017825 Frame 0237.
Aug 21, 2006
From: KANG, BYOUNG-UN; KIM, JAI-HOON; SEO, JOON-MO; SUNG, TAE-HYUN
To: LS CABLE LTD.
Reel/Frame 018154/0970 →
Change of Name
Oct 9, 2008
From: LG CABLE LTD.; LS CABLE LTD.
To: LS CORP.
Reel/Frame 021651/0652 →
Assignment of Assignor's Interest
Oct 10, 2008
From: LS CORP.
To: LS MTRON LTD.
Reel/Frame 021658/0890 →
Assignment of Assignor's Interest
Apr 1, 2014
From: LS MTRON LTD.
To: LG INNOTEK CO., LTD.
Reel/Frame 032570/0108 →
Assignment of Assignor's Interest
Jun 11, 2014
From: LS MTRON LTD.
To: H&S HIGH TECH CORP.
Reel/Frame 033082/0149 →