Patent Assignment
Reel/Frame 017845/0429
Assignment of Assignor's Interest
Recorded: 2006-06-26
Pages: 3
Assignee
TOUCH MICRO-SYSTEM TECHNOLOGY INC.
NO. 566, GAOSHIH RD., YANGMEI TOWNSHIP, TAOYUAN COUNTY, TAIWAN
Covered Property
(1)
Method for Wafer Level Packaging and Fabricating Cap Structures
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.