Patent Assignment
Reel/Frame 033009/0642
Assignment of Assignor's Interest
Recorded: 2014-06-02
Pages: 18
Assignor
TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
Executed: 2014-04-14
Assignee
GREDMANN TAIWAN LTD.
9F., NO. 170, SEC. 3, MIN CHUAN EAST ROAD, JHONGSHAN DIST.,, TAIPEI, TAIWAN
Covered Properties
(16)
Wafer Carrier
Method of Etching Cavities Having Different Aspect Ratios
Method of Forming a Wafer Backside Interconnecting Wire
Micro Sample Heating Apparatus and Method of Making the Same
Method for Wafer-Level Package
Micro Sample Heating Apparatus and Method of Making the Same
Method of Fabricating a Diaphragm of a Capacitive Microphone Device
Patent:
7,258,806 →
Application:
11/426,017 →
Method of Fabricating a Diaphragm of a Capacitive Microphone Device
Method for Wafer Level Packaging and Fabricating Cap Structures
Method for Wafer Level Chip Scale Packaging with Passive Components Integrated into Packaging Structure
Wafer-Level Packaging Cutting Method Capable of Protecting Contact Pads
Interposer for Connecting Plurality of Chips and Method for Manufacturing the Same
Biaxial Scanning Mirror for Image Forming Apparatus
Biaxial Scanning Mirror for Image Forming Apparatus and Method for Operating the Same
Planar Coil and Method of Making the Same
Method for making a planar coil
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 12, 2004
From: YANG, CHEN-HSIUNG
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC
Reel/Frame 015241/0431 →
Assignment of Assignor's Interest
Oct 28, 2004
From: YANG, CHEN-HSIUNG
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC
Reel/Frame 015310/0186 →
Assignment of Assignor's Interest
Nov 19, 2004
From: SHAO, SHIH-FENG; YANG, CHEN-HSIUNG; PENG, HSIN-YA
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC
Reel/Frame 015375/0168 →
Assignment of Assignor's Interest
May 2, 2006
From: PAN, CHIN-CHANG; KANG, YU-FU
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 017558/0077 →
Assignment of Assignor's Interest
May 17, 2006
From: YANG, CHEN-HSIUNG
To: TOUCH MICRO-SYSTEM TECHNOLOGY CO., LTD.
Reel/Frame 017939/0727 →
Assignment of Assignor's Interest
Jun 23, 2006
From: PAN, CHIN-CHANG; KANG, YU-FU
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 017831/0059 →
Assignment of Assignor's Interest
Jun 23, 2006
From: CHEN, CHIH-HSIEN
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 017831/0289 →
Assignment of Assignor's Interest
Jun 23, 2006
From: HO, HSIEN-LUNG
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 017831/0073 →
Assignment of Assignor's Interest
Jun 23, 2006
From: HO, HSIEN-LUNG
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 017831/0070 →
Assignment of Assignor's Interest
Jun 26, 2006
From: SHAO, SHIH-FENG; CHIU, MING-YEN
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 017845/0429 →
Change of the Address of the Assignee
Jul 10, 2007
From: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 019533/0442 →
Change of the Address of the Assignee
Mar 4, 2008
From: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 020592/0258 →
Assignment of Assignor's Interest
Apr 10, 2008
From: TSAI, CHUN-WEI; SHAO, SHIH-FENG
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 020779/0741 →
Change of Name
Sep 24, 2008
From: TOUCH MICRO-SYSTEM TECHNOLOGY CO., LTD.
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 021575/0067 →
Assignment of Assignor's Interest
Nov 19, 2008
From: HUANG, KUAN-JUI; WANG, CHANG-PING; LI, HSIU-MING; HUANG, SHIH-MIN
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 021854/0790 →
Change of the Name and Address of the Assignee
Feb 2, 2009
From: TOUCH MICRO-SYSTEM TECHNOLOGY INC
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 022185/0366 →
Assignment of Assignor's Interest
Jun 17, 2010
From: LIN, HUNG-YI
To: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
Reel/Frame 024550/0423 →
Assignment of Assignor's Interest
Jun 21, 2010
From: LIN, HUNG YI
To: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
Reel/Frame 024564/0528 →
Assignment of Assignor's Interest
Oct 7, 2010
From: LIN, HUNG YI; CHEN, MING FA
To: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
Reel/Frame 025107/0516 →
Assignment of Assignor's Interest
May 28, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMAN TAIWAN LTD.
Reel/Frame 032978/0275 →
Assignment of Assignor's Interest
Nov 14, 2017
From: GREDMANN TAIWAN LTD.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 044442/0960 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →