IP Library › Assignment 020779/0741
Patent Assignment
Reel/Frame 020779/0741

Assignment of Assignor's Interest

Recorded: 2008-04-10 Pages: 3
Assignors
TSAI, CHUN-WEI
Executed: 2008-04-08
SHAO, SHIH-FENG
Executed: 2008-04-08
Assignee
TOUCH MICRO-SYSTEM TECHNOLOGY INC.
566, KAO-SHI RD., YANG-MEI, TAOYUAN HSIEN, TAIWAN
Covered Property (1)
Wafer-Level Packaging Cutting Method Capable of Protecting Contact Pads
Patent: 7,622,334 →
Application: 12/100,392 →
Publication: US 2009/0061598
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 28, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMAN TAIWAN LTD.
Reel/Frame 032978/0275 →
Assignment of Assignor's Interest Jun 2, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMANN TAIWAN LTD.
Reel/Frame 033009/0642 →
Assignment of Assignor's Interest Nov 14, 2017
From: GREDMANN TAIWAN LTD.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 044442/0960 →