Patent Assignment
Reel/Frame 044442/0960
Assignment of Assignor's Interest
Recorded: 2017-11-14
Pages: 8
Assignor
GREDMANN TAIWAN LTD.
Executed: 2017-10-06
Assignee
TESSERA ADVANCED TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(11)
Actuating mechanism for rotating micro-mirror
Patent:
6,359,718 →
Application:
09/838,061 →
Micro Grating Structure
Method of Etching Cavities Having Different Aspect Ratios
Method of Forming a Wafer Backside Interconnecting Wire
External Cavity Tunable Laser System Formed from Mems Corner Mirror
Method for Wafer-Level Package
Method of Fabricating a Diaphragm of a Capacitive Microphone Device
Patent:
7,258,806 →
Application:
11/426,017 →
Wafer-Level Packaging Cutting Method Capable of Protecting Contact Pads
Interposer for Connecting Plurality of Chips and Method for Manufacturing the Same
Integration Manufacturing Process for Mems Device
Integration Manufacturing Process for Mems Device
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 18, 2001
From: LIN, HUNG-YI; FANG, WEILEUN
To: WALSIN LIHWA CORPORATION
Reel/Frame 011734/0697 →
Assignment of Assignor's Interest
Oct 28, 2004
From: YANG, CHEN-HSIUNG
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC
Reel/Frame 015310/0186 →
Assignment of Assignor's Interest
Oct 29, 2004
From: HUANG, LONG-SUN; CHANG, CHAO-SEN; TA-SHUN, CHU; SON-NAN, CHEN
To: WALSIN LIHWA CORP.
Reel/Frame 015955/0102 →
Assignment of Assignor's Interest
Nov 1, 2004
From: HUANG, LONG-SUN; KUO, YAO-HUI
To: WALSHIN LIHHWA CORP.
Reel/Frame 015936/0111 →
Assignment of Assignor's Interest
Nov 19, 2004
From: SHAO, SHIH-FENG; YANG, CHEN-HSIUNG; PENG, HSIN-YA
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC
Reel/Frame 015375/0168 →
Assignment of Assignor's Interest
Jun 23, 2006
From: HO, HSIEN-LUNG
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 017831/0070 →
Assignment of Assignor's Interest
Jun 23, 2006
From: CHEN, CHIH-HSIEN
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 017831/0289 →
Change of the Address of the Assignee
Jul 10, 2007
From: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 019533/0442 →
Change of the Address of the Assignee
Mar 4, 2008
From: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 020592/0258 →
Assignment of Assignor's Interest
Apr 10, 2008
From: TSAI, CHUN-WEI; SHAO, SHIH-FENG
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 020779/0741 →
Assignment of Assignor's Interest
Nov 19, 2008
From: HUANG, KUAN-JUI; WANG, CHANG-PING; LI, HSIU-MING; HUANG, SHIH-MIN
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 021854/0790 →
Assignment of Assignor's Interest
Dec 2, 2008
From: WU, MINGCHING; YANG, HSUEH-AN; LIN, HUNG-YI; FANG, WEILEUN
To: WALSIN LIHWA CORP.
Reel/Frame 021913/0461 →
Assignment of Assignor's Interest
May 28, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMAN TAIWAN LTD.
Reel/Frame 032978/0275 →
Assignment of Assignor's Interest
Jun 2, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMANN TAIWAN LTD.
Reel/Frame 033009/0642 →
Assignment of Assignor's Interest
Jun 3, 2014
From: WALSIN LIHWA CORPORATION
To: GREDMANN TAIWAN LTD.
Reel/Frame 033017/0228 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →