Interposer for connecting plurality of chips and method for manufacturing the same
View Patent ↗The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.
1. A method of forming an interposer, comprising:
providing a connective substrate having a first surface and a second surface, the connective substrate further comprising at least a first dielectric layer, at least a first interconnection and at least a first contact pad disposed on the first surface;
providing an adhesive layer to bond the first surface to a wafer carrier;
forming at least a through hole on the second surface of the connective substrate;
forming a conductive layer to fill the through hole and forming a through via between the first surface and the second surface;
forming at least a second dielectric layer, at least a second interconnection, and at least a second contact pad on the second surface of the connective substrate, wherein the through via electrically connects the second interconnection and the second contact pad; and
separating the first surface and the wafer carrier.
2. The method of claim 1 , further comprising:
forming a stress buffer layer on the second surface of the connective substrate after the first surface is bonded to the wafer carrier.
3. The method of claim 1 , further comprising:
forming a protective layer covering the second dielectric layer and the second interconnection and exposing the second contact pad, after the second dielectric layer, the second interconnection, and the second contact pad are formed on the second surface of the connective substrate.
4. The method of claim 1 , wherein a thinning process is optionally performed on the second surface of the connective substrate after the first surface of the connective substrate is bonded to the wafer carrier.
5. The method of claim 1 , wherein forming the through via further comprises:
performing an electroplating process to form the conductive layer covering the second surface and filling the through hole; and
performing a planarization process to remove a part of the conductive layer on the second surface of the connective substrate and form the through via.