Patent Assignment
Reel/Frame 021854/0790
Assignment of Assignor's Interest
Recorded: 2008-11-19
Pages: 5
Assignors
HUANG, KUAN-JUI
Executed: 2007-05-29
WANG, CHANG-PING
Executed: 2007-05-29
LI, HSIU-MING
Executed: 2007-05-29
HUANG, SHIH-MIN
Executed: 2007-05-29
KUO, HUI-CHEN
Executed: 2007-05-29
CHEN, CHIA-CHUN
Executed: 2007-05-29
Assignee
TOUCH MICRO-SYSTEM TECHNOLOGY INC.
566, KAO-SHI RD., YANG-MEI, TAOYUAN HSIEN, TAIWAN
Covered Property
(1)
Interposer for Connecting Plurality of Chips and Method for Manufacturing the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 28, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMAN TAIWAN LTD.
Reel/Frame 032978/0275 →
Assignment of Assignor's Interest
Jun 2, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMANN TAIWAN LTD.
Reel/Frame 033009/0642 →
Assignment of Assignor's Interest
Nov 14, 2017
From: GREDMANN TAIWAN LTD.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 044442/0960 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →