Patent Assignment
Reel/Frame 015375/0168
Assignment of Assignor's Interest
Recorded: 2004-11-19
Pages: 3
Assignors
SHAO, SHIH-FENG
Executed: 2004-11-15
YANG, CHEN-HSIUNG
Executed: 2004-11-15
PENG, HSIN-YA
Executed: 2004-11-15
Assignee
TOUCH MICRO-SYSTEM TECHNOLOGY INC
NO. 566, GAOSHIH RD., YANGMEI TOWNSHIP, TAOYUAN COUNTY, TAIWAN
Covered Property
(1)
Method of Forming a Wafer Backside Interconnecting Wire
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 28, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMAN TAIWAN LTD.
Reel/Frame 032978/0275 →
Assignment of Assignor's Interest
Jun 2, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMANN TAIWAN LTD.
Reel/Frame 033009/0642 →
Assignment of Assignor's Interest
Nov 14, 2017
From: GREDMANN TAIWAN LTD.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 044442/0960 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →