Method of etching cavities having different aspect ratios
View Patent ↗A method of etching cavities having different aspect ratios. An etching stop layer is formed on the bottom surface of a substrate, and a mask pattern is formed on the top surface of the substrate. The mask pattern includes a plurality of sacrificial patterns positioned on both a first cavity predetermined region and a second cavity predetermined region. Then, an etching process is performed to remove the substrate not covered by the mask layer. Then, the etching stop layer is removed, as well as the sacrificial patterns and the substrate covered by the sacrificial patterns.
1. A method of etching through cavities having different aspect ratios, comprising:
providing a substrate;
forming an etching stop layer on a bottom surface of the substrate;
forming a mask pattern on a top surface of the substrate so as to define at least a first cavity predetermined region and at least a second cavity predetermined region, the mask pattern further comprising a plurality of sacrificial patterns on the first cavity predetermined region and the second cavity predetermined region, wherein the first cavity predetermined region has a dimension different from that of the second cavity predetermined region, and the sacrificial patterns make the first cavity predetermined region and the second cavity predetermined region have same critical dimensions;
performing an etching process to etch through the substrate not covered by the mask pattern until reaching the etching stop layer; and
removing the etching stop layer, the sacrificial patterns and the substrate covered by the sacrificial patterns.
2. The method of claim 1 , wherein sizes, distributions, and arrangement densities of the sacrificial patterns are adjusted according to pattern densities of the mask pattern and parameters of the etching process.
3. The method of claim 1 further comprising the step of removing the mask pattern.
4. The method of claim 1 , wherein the mask pattern further defines a third cavity predetermined region without any sacrificial patterns on the top surface of the substrate.
5. A method of etching cavities having different aspect ratios, comprising:
providing a substrate having at least a first cavity predetermined region and at least a second cavity predetermined region on a top surface;
forming a mask pattern on the top surface of the substrate, the mask pattern exposing the first cavity predetermined region and the second cavity predetermined region, and the mask pattern further comprising a plurality of sacrificial patterns on the first cavity predetermined region and the second cavity predetermined region, wherein the first cavity predetermined region has a dimension different from that of the second cavity predetermined region, and the sacrificial patterns make the first cavity predetermined region and the second cavity predetermined region have same critical dimensions;
performing an etching process to etch the substrate not covered by the mask pattern; and
removing the sacrificial patterns and the substrate covered by the sacrificial patterns.
6. The method of claim 5 wherein sizes, distributions, arrangement densities of the sacrificial patterns are adjusted according to pattern densities of the mask pattern and parameters of the etching process.
7. The method of claim 5 further comprising forming an etching stop layer on a bottom surface of the substrate before performing the etching process.
8. The method of claim 7 , wherein the substrate is etched through until reaching the etching stop layer during the etching process.
9. The method of claim 8 , wherein the sacrificial patterns and the substrate covered by the sacrificial patterns are removed along with the etching stop layer.
10. The method of claim 5 further comprising the step of removing the mask pattern.
11. The method of claim 5 wherein the top surface of the substrate further comprises at least a third cavity predetermined region without any sacrificial patterns thereon.