Patent Assignment
Reel/Frame 017831/0070
Assignment of Assignor's Interest
Recorded: 2006-06-23
Pages: 3
Assignor
HO, HSIEN-LUNG
Executed: 2006-06-16
Assignee
TOUCH MICRO-SYSTEM TECHNOLOGY INC.
NO. 566, GAOSHIH RD., YANGMEI TOWNSHIP, TAOYUAN COUNTY, TAIWAN
Covered Property
(1)
Method of Fabricating a Diaphragm of a Capacitive Microphone Device
Patent:
7,258,806 →
Application:
11/426,017 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of the Address of the Assignee
Jul 10, 2007
From: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 019533/0442 →
Assignment of Assignor's Interest
May 28, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMAN TAIWAN LTD.
Reel/Frame 032978/0275 →
Assignment of Assignor's Interest
Jun 2, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMANN TAIWAN LTD.
Reel/Frame 033009/0642 →
Assignment of Assignor's Interest
Nov 14, 2017
From: GREDMANN TAIWAN LTD.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 044442/0960 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →