IP Library › Assignment 021575/0067
Patent Assignment
Reel/Frame 021575/0067

Change of Name

Recorded: 2008-09-24 Pages: 4
Assignor
Assignee
TOUCH MICRO-SYSTEM TECHNOLOGY INC.
566, KAO-SHI RD., YANG-MEI, TAOYUAN HSIEN, TAIWAN
Covered Property (1)
Method for Wafer Level Chip Scale Packaging with Passive Components Integrated into Packaging Structure
Patent: 7,582,511 →
Application: 11/434,734 →
Publication: US 2007/0161155
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 17, 2006
From: YANG, CHEN-HSIUNG
To: TOUCH MICRO-SYSTEM TECHNOLOGY CO., LTD.
Reel/Frame 017939/0727 →
Assignment of Assignor's Interest May 28, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMAN TAIWAN LTD.
Reel/Frame 032978/0275 →
Assignment of Assignor's Interest Jun 2, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMANN TAIWAN LTD.
Reel/Frame 033009/0642 →