Patent Assignment
Reel/Frame 017939/0727
Assignment of Assignor's Interest
Recorded: 2006-05-17
Pages: 2
Assignor
YANG, CHEN-HSIUNG
Executed: 2006-04-04
Assignee
TOUCH MICRO-SYSTEM TECHNOLOGY CO., LTD.
566, KAO-SHI RD., YANG-MEI, TAOYUAN HSIEN, 32668, R.O.C., TAIWAN
Covered Property
(1)
Method for Wafer Level Chip Scale Packaging with Passive Components Integrated into Packaging Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 24, 2008
From: TOUCH MICRO-SYSTEM TECHNOLOGY CO., LTD.
To: TOUCH MICRO-SYSTEM TECHNOLOGY INC.
Reel/Frame 021575/0067 →
Assignment of Assignor's Interest
May 28, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMAN TAIWAN LTD.
Reel/Frame 032978/0275 →
Assignment of Assignor's Interest
Jun 2, 2014
From: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
To: GREDMANN TAIWAN LTD.
Reel/Frame 033009/0642 →