Patent Assignment
Reel/Frame 017860/0450
Assignment of Assignor's Interest
Recorded: 2005-09-23
Pages: 11
Assignors
IWAMOTO, KUNIHIKO
Executed: 2005-06-27
NABATAME, TOSHIHIDE
Executed: 2005-06-27
TOMINAGA, KOJI
Executed: 2005-06-17
YASUDA, TETSUJI
Executed: 2005-06-20
Assignees
ROHM CO., LTD.
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO, 615-8585, JAPAN
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-6334, JAPAN
HORIBA, LTD.
2, MIYANOHIGASHI-CHO, KISSHOIN, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8510, JAPAN
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
1-1, HIGASHI 1-CHOME, TSUKUBA-SHI, IBARAKI, 305-8562, JAPAN
Covered Property
(1)
Semiconductor Device, Process for Producing the Same and Process for Producing Metal Compound Thin Film
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 20, 2007
From: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
To: ROHM CO., LTD.; RENESAS TECHNOLOGY CORP.; HORIBA, LTD.
Reel/Frame 019852/0511 →
Assignment of Assignor's Interest
Nov 11, 2010
From: HORIBA LTD
To: ROHM CO., LTD.
Reel/Frame 025349/0694 →
Assignment of Assignor's Interest
Jun 27, 2012
From: RENESAS ELECTRONICS CORPORATION
To: ROHM CO., LTD.
Reel/Frame 028451/0572 →
Change of Name
Jun 27, 2012
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 028451/0959 →