IP Library Assignment 017942/0685
Patent Assignment
Reel/Frame 017942/0685

Assignment of Assignor's Interest

Recorded: 2006-05-27 Pages: 3
Assignors
CHEN, KUANG-HSIN
Executed: 2003-11-25
LU, JHI-CHERNG
Executed: 2003-11-25
HSU, PENG-GU
Executed: 2003-11-25
LEE, DI-HONG
Executed: 2003-11-25
TSAO, HSUN-CHIH
Executed: 2003-11-25
HOU, CHUAN-PING
Executed: 2003-11-25
CHEN, HUNG-WEI
Executed: 2003-11-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8. LI-HSIN RD. 6, SCINCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property (1)
Fin-Fet Device Structure Formed Employing Bulk Semiconductor Substrate
Patent: 7,663,185 →
Application: 11/441,724 →
Publication: US 2007/0272954
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →