Patent Assignment
Reel/Frame 017999/0326
Assignment of Assignor's Interest
Recorded: 2006-06-15
Pages: 3
Assignors
YAMAMICHI, SHINTARO
Executed: 2006-06-05
KIKUCHI, KATSUMI
Executed: 2006-06-05
MURAI, HIDEYA
Executed: 2006-06-05
FUNAYA, TAKUO
Executed: 2006-06-05
MAEDA, TAKEHIKO
Executed: 2006-06-05
OGAWA, KENTA
Executed: 2006-06-05
TSUKANO, JUN
Executed: 2006-06-05
HONDA, HIROKAZU
Executed: 2006-06-05
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Wiring Board, Method for Manufacturing Same, and Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0842 →
Assignment of Assignor's Interest
Jul 12, 2013
From: NEC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0873 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →