Patent Assignment
Reel/Frame 018074/0097
Assignment of Assignor's Interest
Recorded: 2006-08-08
Pages: 2
Assignor
TUNG, CHING-WEN
Executed: 2006-08-08
Assignee
HUGA OPTOTECH INC.
NO. 40, INDUSTRIAL 34 ROAD, TAICHUNG INDUSTRIAL PARK, TAICHUNG, TAIWAN
Covered Property
(1)
Flip-Chip Packaging Structure for Light Emitting Diode and Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.