Patent Assignment
Reel/Frame 018105/0677
Assignment of Assignor's Interest
Recorded: 2006-07-13
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Interposer Including Air Gap Structure, Methods of Forming the Same, Semiconductor Device Including the Interposer, and Multi-Chip Package Including the Interposer