IP Library › Assignment 018144/0394
Patent Assignment
Reel/Frame 018144/0394

Assignment of Assignor's Interest

Recorded: 2006-07-31 Pages: 3
Assignors
KOK, CHI WAH
Executed: 2006-07-31
TAM, YEE CHING
Executed: 2006-07-31
Assignee
PROMAX TECHNOLOGY (HONG KONG) LIMITED
72 TAT CHEE AVE., UNIT 133, 1/F, TECH CENTER, KOWLOON TONG, KOWLOON, HONG KONG
Covered Property (1)
Substrate and Process for Semiconductor Flip Chip Package
Patent: 7,652,374 →
Application: 11/496,111 →
Publication: US 2008/0023829
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 18, 2007
From: PROMAX TECHONOLGY (HONG KONG) LIMITED
To: HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY, THE
Reel/Frame 019183/0629 →
Assignment of Assignor's Interest Nov 16, 2007
From: PROMAX TECHNOLOGY (HONG KONG) LIMITED
To: HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY R AND D CORPORATION LIMITED
Reel/Frame 020124/0653 →
Assignment of Assignor's Interest Feb 4, 2008
From: HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY R AND D CORPORATION LIMITED
To: INTELLECTUAL VENTURES FUND 27 LLC
Reel/Frame 020458/0022 →
Assignment of Assignor's Interest Apr 15, 2009
From: PROMAX TECHNOLOGY (HONG KONG) LIMITED
To: INTELLECTUAL VENTURES FUND 27 LLC
Reel/Frame 022550/0253 →
Re-Record to Correct the Name of the Assignor, Previously Recorded on Reel 020458 Frame 0022. Apr 22, 2009
From: HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY ("HKUST")
To: INTELLECTUAL VENTURES FUND 27 LLC
Reel/Frame 022581/0248 →