Assignment of Assignor's Interest

Recorded: 2006-08-29 Pages: 3

Assignor

CHAN, VINCENT K.

Executed: 2006-08-23

Assignee

ATI TECHNOLOGIES INC.

1 COMMERCE VALLEY DRIVE EAST, MARKHAM, ONTARIO, L3T 7X6, CANADA

Covered Property (1)

Flip Chip Semiconductor Assembly with Variable Volume Solder Bumps

Application: 11/467,036 →

Publication: US 2008/0048321

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.