IP Library › Assignment 031867/0034
Patent Assignment
Reel/Frame 031867/0034

Change of Name

Recorded: 2013-12-20 Pages: 3
Assignor
ATI TECHNOLOGIES INC.
Executed: 2006-10-25
Assignee
ATI TECHNOLOGIES ULC
1 COMMERCE VALLEY DRIVE EAST, MARKHAM, ONTARIO, L3T 7X6, CANADA
Covered Properties (2)
Flip Chip Semiconductor Assembly with Variable Volume Solder Bumps
Application: 11/467,036 →
Publication: US 2008/0048321
Flip Chip Semiconductor Assembly with Variable Volume Solder Bumps
Patent: 8,637,391 →
Application: 12/437,027 →
Publication: US 2009/0218689
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2006
From: CHAN, VINCENT K.
To: ATI TECHNOLOGIES INC.
Reel/Frame 018183/0897 →