Patent Assignment
Reel/Frame 018244/0024
Assignment of Assignor's Interest
Recorded: 2006-08-25
Pages: 3
Assignors
NAKAMURA, JUNICHI
Executed: 2006-08-23
KOBAYASHI, YUJI
Executed: 2006-08-23
YAMAGIWA, MIKIO
Executed: 2006-08-23
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO 381-2287, JAPAN
Covered Property
(1)
Multilayered Wiring Board and Method for Fabricating the Same