Multilayered wiring board and method for fabricating the same
In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107 , in the plurality of laminated insulating layers 104, 106, 107 , the insulating layer 106 disposed at a laminating center in a laminating direction is made to constitute an insulating layer with a reinforcing member including a reinforcing member.
1. A multilayered wiring board comprising:
wiring layers; and
insulating layers, wherein
the wiring layers and the insulating layers are laminated to form a plurality of layers;
at least one of the insulating layers is an insulating layer including a reinforcing member; and
the wiring layers and the insulating layers not including reinforcing members are symmetrically arranged with respect to the insulating layer including a reinforcing member, wherein the thickness of the at least one insulating layer including a reinforcing member is equal to or smaller than about 100 μm.
2. The multilayered wiring board according to claim 1 , wherein
the insulating layer including a reinforcing member is a woven cloth or a nonwoven cloth impregnated by a resin.
3. The multilayered wiring board according to claim 1 , wherein the insulating layers are formed by a resin.
4. The multilayered wiring board according to claim 1 , wherein the insulating layer including a reinforcing member is a resin mixed with the reinforcing member.
5. The multilayered wiring board according to claim 1 , wherein
the plurality of laminated insulating layers are the laminated insulating layers including reinforcing members.
6. The multilayered wiring board according to claim 1 , wherein
the thickness of the at least one insulating layer including a reinforcing member is about 15 through 100 μm.
7. The multilayered wiring board according to claim 1 , wherein
the at least one insulating layer comprising a reinforcing member is laminated at the center of the multilayered wiring board.
8. The multilayered wiring board according to claim 1 , wherein
insulating layers comprising reinforcing members are laminated at the outermost of the multilayered wiring board.
9. The multilayered wiring board according to claim 1 , wherein
insulating layers comprising reinforcing members are laminated symmetrically with respect to an insulating layer at the center of multilayered wiring board; and
insulating layers laminated at other portions do not comprise reinforcing members.
10. The multilayered wiring board according to claim 1 , wherein
insulating layers comprising reinforcing members are laminated at the center and at the outermost of the multilayered wiring board.
11. The multilayered wiring board according to claim 1 , wherein
each of the insulating layers comprises a reinforcing member.
12. A method of fabricating a multilayered wiring board comprising the steps of:
repeatedly forming a wiring and an insulating layer by using a resin on a support board, and
removing the support board, wherein
in the steps of forming the insulating layers, at least one of the insulating layers is formed by a resin including a reinforcing member; and
the wiring layers and the insulating layers not including reinforcing members are symmetrically arranged with respect to the insulating layer including a reinforcing member, wherein the thickness of the at least one insulating layer including a reinforcing member is egual to or smaller than about 100 μm.
13. The method of fabricating a multilayered wiring board according to claim 12 , wherein the insulating layers are made by a build-up resin.
14. The method of fabricating a multilayered wiring board according to claim 12 , further comprising the steps of:
pasting together two sheets of support boards; and
separating the two sheets of support boards respectively formed with the insulating layers and the wirings.
15. The method of fabricating a multilayered wiring board according to claim 12 , further comprising the steps of:
respectively pasting two sheets of support boards to a first face and a second face of a holding board holding the two sheets of the support boards; and
separating the two sheets of the support boards respectively formed with the insulating layers and the wirings from the holding board.
16. The method of fabricating a multilayered wiring board according to claim 12 , further comprising the step of:
mounting a semiconductor chip to the multilayered wiring board.
17. The method of fabricating a multilayered wiring board according to claim 16 , wherein
the step of removing the support board is carried out after the step of mounting the semiconductor chip.
18. The method of fabricating a multilayered wiring board according to claim 12 , wherein
the thickness of the at least one insulating layer including a reinforcing member is about 15 through 100 μm.
19. The method according to claim 12 , wherein
the insulating layer comprising a reinforcing member is laminated at the center of the multilayered wiring board.
20. The method according to claim 12 , wherein
insulating layers comprising reinforcing members are laminated at the outermost of the multilayered wiring board.
21. The method according to claim 12 , wherein
insulating layers comprising reinforcing members are laminated symmetrically with respect to an insulating layer at the center of multilayered wiring board; and
insulating layers laminated at other portions do not comprise reinforcing members.
22. The method according to claim 12 , wherein
insulating layers comprising reinforcing members are laminated at the center and at the outermost of the multilayered wiring board.
23. The method according to claim 12 , wherein
each of the insulating layers comprises a reinforcing member.