Patent Assignment
Reel/Frame 018364/0478
Assignment of Assignor's Interest
Recorded: 2006-10-09
Pages: 3
Assignor
JUNG, MYUNG JIN
Executed: 2006-09-12
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating Thereof Capable of Reducing a Shallow Trench Isolation Stress Influence by Utilizing Layout Pattern Designs
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.