Patent Assignment
Reel/Frame 018372/0157
Assignment of Assignor's Interest
Recorded: 2006-10-05
Pages: 5
Assignors
CLEVENGER, LAWRENCE
Executed: 2006-06-01
DALTON, TIMOTHY JOSEPH
Executed: 2006-06-01
HSU, LOUIS
Executed: 2006-05-31
RADENS, CARL
Executed: 2006-06-01
RAMACHANDRAN, VIDHYA
Executed: 2006-08-22
WONG, KEITH WONG HON
Executed: 2006-05-31
YANG, CHIH-CHAO
Executed: 2006-05-31
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
ARMONK, NEW YORK, 10504
Covered Property
(1)
Semiconductor Integrated Circuit Devices Having High-Q Wafer Backside Inductors and Methods of Fabricating Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →