IP Library Assignment 018382/0921
Patent Assignment
Reel/Frame 018382/0921

Assignment of Assignor's Interest

Recorded: 2006-10-03 Pages: 3
Assignors
FOSTER, JOHN S.
Executed: 2006-09-14
HOVEY, STEVEN H.
Executed: 2006-09-14
RUBEL, PAUL J.
Executed: 2006-09-14
RYBNICEK, KIMON
Executed: 2006-09-20
Assignee
INNOVATIVE MICRO TECHNOLOGY
75 ROBIN HILL ROAD, GOLETA, CALIFORNIA, 93117
Covered Property (1)
Interconnect Structure Using Through Wafer Vias and Method of Fabrication
Patent: 7,675,162 →
Application: 11/541,774 →
Publication: US 2008/0079120
Related Assignments (8)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044553/0257 →
Security Interest Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: AGILITY CAPITAL II, LLC
Reel/Frame 044635/0492 →
Release of Security Interest Oct 15, 2018
From: AGILITY CAPITAL II, LLC
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 047237/0141 →
Release of Security Interest Jan 30, 2019
From: PACIFIC WESTERN BANK
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 048195/0441 →
Change of Name Dec 30, 2022
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 062253/0077 →
Corrective Assignment to Correct the City of the Assignee Previously Recorded on Reel 062253 Frame 0077. Assignor(S) Hereby Confirms the Change of Name. Jan 9, 2023
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 062320/0509 →
Security Interest Feb 23, 2023
From: ATOMICA CORP.
To: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
Reel/Frame 062841/0341 →
Release of Security Interest Mar 12, 2025
From: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
To: ATOMICA CORP.
Reel/Frame 070485/0737 →