Patent Assignment
Reel/Frame 018384/0778
Assignment of Assignor's Interest
Recorded: 2006-10-04
Pages: 3
Assignors
KIKUCHI, KATSUMI
Executed: 2006-09-25
YAMAMICHI, SHINTARO
Executed: 2006-09-25
KURITA, YOICHIRO
Executed: 2006-09-25
SOEJIMA, KOJI
Executed: 2006-09-25
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Multilayered Wiring Board, Semiconductor Device in Which Multilayered Wiring Board Is Used, and Method for Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0851 →
Assignment of Assignor's Interest
Jul 12, 2013
From: NEC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0873 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →