Patent Assignment
Reel/Frame 018401/0831
Assignment of Assignor's Interest
Recorded: 2006-10-11
Pages: 3
Assignors
HSU, SHIH-HSUN
Executed: 2006-09-21
JENG, SHIH-PUU
Executed: 2006-09-21
HOU, SHANG-YUN
Executed: 2006-09-21
CHEN, HSIEN-WEI
Executed: 2006-09-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, ROC 300-77, TAIWAN
Covered Property
(1)
Bond Pad Structures and Integrated Circuit Chip Having the Same