IP Library Assignment 018414/0827
Patent Assignment
Reel/Frame 018414/0827

Assignment of Assignor's Interest

Recorded: 2006-10-20 Pages: 4
Assignors
MIYAMOTO, NOBUAKI
Executed: 2006-09-12
CHINDA, AKIRA
Executed: 2006-09-12
HIRASAWA, KOKI
Executed: 2006-09-12
UCHIDA, KENJI
Executed: 2006-09-12
Assignees
HITACHI CABLE, LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JAPAN
Covered Property (1)
Electronic Device Substrate and Its Fabrication Method, and Electronic Device and Its Fabrication Method
Patent: 7,705,245 →
Application: 11/530,344 →
Publication: US 2007/0235218
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0851 →
Merger Jan 29, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032134/0723 →