IP Library Assignment 018439/0145
Patent Assignment
Reel/Frame 018439/0145

Assignment of Assignor's Interest

Recorded: 2006-10-26 Pages: 5
Assignors
WU, ZIYAN
Executed: 2004-12-14
HSIEH, HARRY W.
Executed: 2004-12-13
HEBERER, DANIEL P.
Executed: 2004-12-14
ALLAM, DOMINIC J.
Executed: 2004-12-14
Assignee
DOW GLOBAL TECHNOLOGIES INC.
WASHINGTON STREET, 1790 BUILDING, MIDLAND, MICHIGAN, 48674
Covered Property (1)
System for Bonding Glass into a Structure
Patent: 7,494,540 →
Application: 11/012,606 →
Publication: US 2006/0124225
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 23, 2005
From: WU, ZIYAN; HSIEH, HARRY W.; HEBERER, DANIEL P.; ALLAM, DOMINIC J.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 016177/0674 →
Change of Name Jul 20, 2017
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 043260/0627 →