IP Library › Assignment 043260/0627
Patent Assignment
Reel/Frame 043260/0627

Change of Name

Recorded: 2017-07-20 Pages: 5
Assignor
DOW GLOBAL TECHNOLOGIES INC.
Executed: 2010-12-31
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property (1)
System for Bonding Glass into a Structure
Patent: 7,494,540 →
Application: 11/012,606 →
Publication: US 2006/0124225
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 23, 2005
From: WU, ZIYAN; HSIEH, HARRY W.; HEBERER, DANIEL P.; ALLAM, DOMINIC J.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 016177/0674 →
Assignment of Assignor's Interest Oct 26, 2006
From: WU, ZIYAN; HSIEH, HARRY W.; HEBERER, DANIEL P.; ALLAM, DOMINIC J.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 018439/0145 →