Patent Assignment
Reel/Frame 018475/0615
Assignment of Assignor's Interest
Recorded: 2006-10-20
Pages: 2
Assignors
ISHIGAKI, SATORU
Executed: 2006-08-10
UCHIDA, HIROSHI
Executed: 2006-08-10
MIYAJIMA, YOSHIO
Executed: 2006-08-10
MORINAKA, KATSUTOSHI
Executed: 2006-08-10
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO 105-8518, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Cured Product Thereof and Production Method of Printed Circuit Board Using the Same