Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same
There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1): CH 2 ═CH—COO—R—NCO (1) (wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).
1. A photosensitive resin composition comprising: a photopolymerizable component containing a urethane acrylate compound (A) a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), an epoxy resin as a thermosetting resin (C), a photopolymerization initiator (D), and a thermal polymerization catalyst (E); wherein said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1):
CH 2 ═CH—COO—R—NCO (1)
(wherein R represents a hydrocarbon group having 1 to 30 carbon atoms) with polyhydroxy compounds (a-2), wherein at least one of said polyhydroxy compounds (1-2) is a polyol compound having a carboxyl group, and
wherein the number average molecular weight of the urethane acrylate compound (A) is 1,000 to 40,000, and the acid value of the urethane acrylate compound (A) is 5 to 150 mg KOH/g.
2. The photosensitive resin composition according to claim 1 further comprising an organic solvent.
3. The photosensitive resin composition according to claim 2 wherein the viscosity of the composition at 25° C. is 500 to 500,000 mPa·s.
4. The photosensitive resin composition according to claim 1 wherein the composition is used as a resist.
5. The photosensitive resin composition according to claim 1 wherein the composition is used as a solder resist.
6. A dry film resist having on a support a photosensitive layer formed from the photosensitive resin composition according to claim 1 .
7. The dry film resist according to claim 6 wherein the support is a polyester film.
8. A process for the preparation of a dry film resist having a photosensitive layer formation step in which the photosensitive resin composition according to claim 1 is coated onto a support and dried.
9. A cured product formed from the photosensitive resin composition according to claim 1 .
10. An insulating protective coating formed using the photosensitive resin composition according to claim 1 .
11. A printed circuit board having the insulating protective coating according to claim 10 .
12. The printed circuit board according to claim 11 that is a flexible printed wiring board.
13. A process for the preparation of a printed circuit board comprising a lamination step in which a photosensitive layer of the dry film resist according to claim 6 and a substrate are laminated, an exposure step in which the photosensitive layer is exposed, a developing step following the exposure step, and a thermosetting step in which the photosensitive layer is heat-cured.
14. A process for the preparation of a printed circuit board comprising a lamination step in which a photosensitive layer of the dry film resist according to claim 7 and a substrate are laminated, an exposure step in which the photosensitive layer is exposed, a developing step following the exposure step, and a thermosetting step in which the photosensitive layer is heat-cured.