IP Library Assignment 018518/0377
Patent Assignment
Reel/Frame 018518/0377

Assignment of Assignor's Interest

Recorded: 2006-11-14 Pages: 4
Assignor
LEE, JAE SUK
Executed: 2006-11-13
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device Having Diffusion Barriers and a Method of Preventing Diffusion of Copper in a Metal Interconnection of a Semiconductor Device
Patent: 7,670,948 →
Application: 11/559,724 →
Publication: US 2007/0111524
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →