IP Library Assignment 018529/0668
Patent Assignment
Reel/Frame 018529/0668

Assignment of Assignor's Interest

Recorded: 2006-11-16 Pages: 3
Assignors
LEE, WEN-CHIN
Executed: 2006-11-10
LIN, CHENG-HSIEN
Executed: 2006-11-10
Assignee
FOXCONN ADVANCED TECHNOLOGY INC.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property (1)
Method for Forming Stacked via-Holes in a Multilayer Printed Circuit Board
Patent: 7,418,780 →
Application: 11/560,787 →
Publication: US 2007/0266559
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Sep 13, 2011
From: FOXCONN ADVANCED TECHNOLOGY INC.
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 026893/0739 →
Assignment of Assignor's Interest Jan 17, 2017
From: ZHEN DING TECHNOLOGY CO., LTD.
To: GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0807 →